CEO Hock Tan just said co packaged optics are overhyped: “You want to connect XPU to XPU directly with direct attach copper wherever possible because it is the lowest latency, lowest power, and lowest cost option. That remains true for scale up inside a rack or cluster domain, where Broadcom can keep pushing copper from 100G to 200G to 400G, including 400G SerDes that can reach across a rack. For scale out, optical is already the right answer. But for scale up, the message is simple, stay on copper as long as you can, and do not rush into CPO just because it is the shiny new thing. CPO will matter, but later, not this year, and probably not next year.”
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CEO Hock Tan just said co packaged optics are overhyped:
“You want to connect XPU to XPU directly with direct attach copper wherever possible because it is the lowest latency, lowest power, and lowest cost option. That remains true for scale up inside a rack or cluster domain, where Broadcom can keep pushing copper from 100G to 200G to 400G, including 400G SerDes that can reach across a rack.
For scale out, optical is already the right answer. But for scale up, the message is simple, stay on copper as long as you can, and do not rush into CPO just because it is the shiny new thing. CPO will matter, but later, not this year, and probably not next year.”