Semiconductors are the coolest kids on the block. Koreans are aggressively pushing the market.
By the time all of SK Hynix and Samsung's production capacities are built, it will still be possible to consider retreating. But that will be after 1.5 years. Current bottlenecks: TSMC's CoWoS advanced packaging capacity, and the capacities of several memory suppliers. Especially after the advent of HBM4, the Base Die will all rely on TSMC.
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Semiconductors are the coolest kids on the block. Koreans are aggressively pushing the market.
By the time all of SK Hynix and Samsung's production capacities are built, it will still be possible to consider retreating. But that will be after 1.5 years.
Current bottlenecks: TSMC's CoWoS advanced packaging capacity, and the capacities of several memory suppliers.
Especially after the advent of HBM4, the Base Die will all rely on TSMC.