Huanghe Xuanfeng: The company's related products are not directly applied in the semiconductor packaging field.

Jin10 data reported on May 27 that Huanghe Xuanfeng issued a risk warning announcement regarding the establishment of a joint venture company, stating that the company’s products cover superhard materials and polycrystalline composite material products, superhard cutting tools, metal powders, etc.; the main business is industrial diamonds and cultured BCD-related materials and products. Currently, the company’s related products have not been directly applied in the semiconductor packaging field, and there has been no revenue generated from the semiconductor packaging field. The company, together with Bozhi Jindian, established a joint venture with a registered capital of 10 million yuan, with the company contributing 5.1 million yuan, accounting for 51%, which is relatively small. In the future, as technology develops, more funding may be required, and there is still significant uncertainty regarding whether the company will further invest. After the establishment of the joint venture, the actual operational process may still be affected by factors such as the macro economy, industry environment, and policies, and there remains significant uncertainty regarding future development and investment returns.