NaiKe Equipment plans to invest 41.61 million yuan to upgrade the manufacturing of advanced packaging equipment.

[Shanghai, March 20, 2026] Anhui Naiko Equipment Technology Co., Ltd. (stock code: 688419, stock abbreviation: Naiko Equipment) announced today that the company plans to use part of the remaining funds of 41.61 million yuan (including interest and cash management income) raised from its initial public offering to invest in the “New Semiconductor Packaging Equipment Construction Project.” This proposal has been approved by the company’s board of directors and audit committee and will be submitted to the shareholders’ meeting for review.

The announcement indicates that the new project will be implemented within the company’s existing factory area, without the need for additional land or new buildings. The main focus will be on the partial renovation of the existing semiconductor packaging equipment factory, with a renovation area of 2,000 square meters and a total of 31 new production and auxiliary equipment units. Upon completion of the project, 20 units will be adjusted from the original annual production capacity of 80 units of semiconductor automatic packaging equipment from the “New Semiconductor Packaging Equipment Construction Project” to manufacture advanced packaging process equipment, achieving an annual production capacity of 20 advanced packaging semiconductor equipment units.

The total investment for the project is 41.61 million yuan, with specific investment details as follows:

The company stated that the implementation of the new project is mainly based on three considerations: first, to align with national policy guidance and seize development opportunities in the integrated circuit industry; second, to meet the market demand for domestic advanced packaging equipment and enhance the company’s market position; third, to improve the company’s profitability and market competitiveness through product upgrades and optimization.

In terms of feasibility analysis, Naiko Equipment pointed out that the current market outlook for semiconductor packaging equipment is broad. According to data from the Semiconductor Equipment and Materials International (SEMI), global sales of packaging equipment are expected to reach 6.4 billion U.S. dollars in 2025, a year-on-year increase of 19.6%, with continued growth expected over the next two years. As an important player in the domestic semiconductor packaging equipment sector, the company has key clients such as Huada Technology, Tongfu Microelectronics, Changjiang Electronics, and Nexperia, possessing the necessary technology, talent, and market foundation to implement this project.

The announcement also highlighted potential risks associated with the project, including the possibility that new product development and market expansion may not meet expectations, short-term declines in return on net assets, and management risks associated with scale expansion.

The company’s board of directors’ audit committee and the sponsoring institution have issued no-objection opinions regarding this matter, believing that the use of remaining raised funds for the new project complies with relevant laws and regulations, will improve the efficiency of fund utilization, and aligns with the company’s main business development needs.

According to the plan, the new project will commence within six months from the date of approval by the shareholders’ meeting, with a construction period of 36 months. After the project’s implementation, the company will open a dedicated account for the raised funds and sign a tripartite supervision agreement with commercial banks and the sponsoring institution to ensure the standardized use of the raised funds.

Naiko Equipment completed its initial public offering in October 2022, raising a total of 775.925 million yuan, with actual raised funds amounting to 701.3313 million yuan after deducting issuance expenses. In December 2025, the company made changes to the investment scale and completed projects for multiple fundraising projects, including the “New Semiconductor Packaging Equipment Construction Project.”

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