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Samsung Showcases HBM4 Chip Designed for Nvidia Vera Rubin Platform
Investing.com – Samsung announced on Tuesday that its sixth-generation HBM4 memory chips designed for Nvidia Vera Rubin platform reach speeds of 11.7 Gbps per second, with the potential to reach 13 Gbps.
This exceeds the industry standard of 8 Gbps per second. The company’s upgraded HBM4E variant operates at speeds of 16 Gbps.
The announcement was made at Nvidia’s GPU Technology Conference, where Samsung highlighted its artificial intelligence computing technology and its partnership with the American chip manufacturer.
This showcase solidifies Samsung’s position in the emerging HBM4 market amid the AI boom. Last month, the company stated it was the first to mass-produce and ship HBM4 products. Samsung plans to provide HBM4E samples to customers in the second half of this year.
Although Samsung is the world’s largest memory chip manufacturer, it has lagged behind smaller competitors like SK Hynix (KS:000660) and Micron Technology (NASDAQ:MU) in supplying early-generation HBM3 and HBM3E chips to Nvidia (NASDAQ:NVDA).
At the conference, Samsung stated it would demonstrate its comprehensive AI computing technology and capabilities.
The company claims to be the only semiconductor company offering a full suite of AI solutions covering memory, logic, wafer fabrication, and advanced packaging.
Samsung said on Tuesday, “Samsung will showcase its complete range of products and solutions to enable customers to design and build groundbreaking AI systems.”
Nvidia CEO Jensen Huang outlined a series of new hardware and software products at the conference. Huang stated that the company expects Blackwell and Rubin chips to generate $1 trillion in sales by the end of 2027.
This article was translated with the assistance of artificial intelligence. For more information, please see our Terms of Use.