Feynman Architecture Ushers in Chip Optical Interconnect Era, CPO Industry Faces Value Reassessment

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People’s Financial News, March 18 — Interconnection between chips, as the core infrastructure of global AI computing power, is experiencing a historic shift from “electric” to “optical.” On March 16, local time, NVIDIA announced the release of the Feynman chip, which for the first time introduced optical communication into chip-to-chip interconnects, reducing AI data center communication energy consumption by over 70%. Analysts believe that with the establishment of overseas technological pathways and increased domestic industrial policies, leading optical module manufacturers deeply embedded in the global computing power supply chain and those with CPO technology reserves in A-shares are expected to be among the first to enter the performance realization phase amid the new infrastructure wave of “computing and power synergy.” (China Securities Journal)

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