3M expands optical interconnect manufacturing for AI data centers

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3M announced plans to significantly expand its U.S. manufacturing capacity for Expanded Beam Optical (EBO) interconnect technology to meet the escalating demand from AI data centers. This expansion will more than double production, adding new equipment and space, to support high-speed data transmission crucial for AI computing. The investment targets hyperscalers and networking providers, underscoring the growing adoption of optical interconnects in high-density AI environments.

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