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Runjian Co., Ltd. completes issuance of the first phase of Sci-Tech Innovation Bonds worth 500 million yuan with an interest rate of 1.78%
****Viewpoint Network News: On March 11, Runjian Co., Ltd. completed the issuance of its first phase of technological innovation bonds for 2026.
This bond is abbreviated as “26RunjianCoCP001 (Tech Innovation Bond),” with a total actual issuance of 500 million yuan, an interest rate of 1.78%, a term of 270 days, with the start date on March 11, 2026, and the maturity date on December 6, 2026.
The bond was issued on March 10, 2026, and the funds were received the next day, on March 11. The bonds are underwritten and managed by Shanghai Pudong Development Bank, with co-lead underwriters including Guangxi Beibu Gulf Bank and China Postal Savings Bank.
Disclaimer: The content and data of this article are compiled by Viewpoint based on publicly available information and do not constitute investment advice. Please verify before use.